DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]
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Description
Description
Polishing Compound - Fine Cut - 32oz
This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.
Features:
- Effectively removes holograms
- Free of solvents and silicone
- Appearance: Cream/Paste
- Solubility: N/A
- pH: 8
Use & Application:
For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.
Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.
Specifications:
- Type: Restoration & Compounds
- Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
- UPC: 850019168440
Brochure (pdf)
DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]
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